New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

Utilizing laser scanning, OBIC provides spatially resolved photocurrent maps in integrated circuits, crucial for effective ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...